BEST BGA Inspection and Rework Process | United States

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BGA inspection is the process which is being done to analyse the connections between a chip and a PCB. In order to inspect BGA, there are 3 methods i.e Optical Inspection, Mechanical Inspection, X-Ray Inspection. X-ray Inspection is the most advanced and fastest method for BGA. Not only the correct BGA inspection tools are required, but a proper interpretation of the inspection criteria and standards is required along with trained and experienced inspector. At BEST, we have reworked and inspected thousands of different types of BGAs using industry or customer-developed inspection criteria. Visit us to know more in technical details of BGA Inspection. Anyone can call us at 847-797-9250 or visit solder.net